• Stable colloidal activator for plating on ABS and ABS-PC substrates.
• Advanced technology product to operate at low palladium concentration of 12 – 16 ppm .
• Combining with JCU catalyst adsorption promoter, stable production is possible on difficult to plate material like high PC containing ABS alloys.
• RoHS compliant lead-free Electroless Nickel process for plating on plastics.
• Smooth and uniform deposit with very good adhesion property.
• Process with good activity for complete coverage and good stability that prevent
any coating on the tank walls.
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